Detailed description

@RFID Prelaminated inlays are dedicated to card manufacturing, providing high quality technology core. The complex multilayer structure based on PVC, PETG or PC substrates varies in thickness and size, following customer's requirements. The middle layer incorporates the transponder consisting of wired antenna and chip module or connectors for dual interface module. The transponders have various designs and can be aligned for different layouts. All technological configurations are available - LF, HF/NFC, UHF, hybrids, as well as dual interface inlays for flex-bump, inductive coupling or ACF dual interface module embedding.

  • Product reference
    Prelaminated Inlays
  • Manufactured by
    @RFID

Exhibitor

Exhibitor

@RFID

Truly international, @RFID benefits from its local involvement in different countries in pursuing its strategy of global development targeting a worldwide leadership in card inlays, RFID, IOT smart sensing and contactless technologies.

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